- Cyber Security IC
- Backend Electric Automation Tool for IC Design
- AI on Chip
- Bio-Chip
- SiC Quality Control and Testing Equipment (or Laser Application)

- semiconductor manufacturing in the Czech Republic, specifically SiC applications

- automotive industry: digital and analogue chips

- renewables and energy: power electronics

- electronics: advanced power management for portable devices and low-power designs for battery-powered applications

- biomedical applications: novel sensors and signal processing methods for healthcare, fitness and aging populations (including signal processing chip design, digital design, FPGAs and AD/DA converters)

- telecommunications industry: radio frequency chip design

- applications in the space sector

- chip design tools industry: automation of RISC-V and backend integrated circuit design based on machine learning

Embedded AI processor for automotive applications
Development of an FPGA-based processor for automotive applications with a focus on low power, efficiency and performance. The processor will be able to process image signals and recognize objects, which will support the wider use of intelligent systems in the automotive industry in the Czech Republic and Europe.

Hardware safety modules
Development of advanced security technologies, including:
- MSOTP (multi-state one-time programmable memory) for secure data storage
- PUF (physical unclonable function) for creating unique, unforgeable encryption keys
- Post-quantum cryptography (PQC) to protect against future quantum computing threats

The goal is to create a PUF-based PQC subsystem, which will be the first solution of its kind on the market to provide advanced protection for sensitive data. The development includes optimization of stability, randomness and circuit performance, ending with a verification phase to meet commercial standards.

Laser processing of SiC wafers
Development of a new technology for laser grinding and modification of silicon carbide (SiC) wafers for the production of high performance semiconductor devices. The aim is to optimise the wafer thinning process using laser radiation with suitable parameters (wavelength, pulse width, energy, repetition rate). The collaboration between Taiwan and the Czech Republic will enable a combination of cutting-edge technological development and advanced quality control through X-ray diffraction rocking curve and advanced crystal defect visualisation methods.

AI and optimization for electronic design automation (EDA)
Collaborative research and development of tools for electronic design automation (EDA) with a focus on mixed-signal design and chip reliability. The project will combine the know-how of academic institutions and industrial partners from Taiwan and the Czech Republic. The aim is to improve design methods in the areas of automotive electronics and satellite technology, where performance, power consumption and long-term chip reliability are key factors.

ACDRC educational projects will include international internships and exchange visits for Ph.D. students between the Czech Republic and Taiwan. The students will have the opportunity to participate in semiconductor technology development and applied research projects both in Czech laboratories and in Taiwan, for example at Jmem Tek, NCU and NCHU institutions.

If you are interested in an internship or collaboration, or have questions about specific research projects, please contact the researcher at your school directly:

- CTU - Ing. Radek Holý, Ph.D. (radek.holy@cvut.cz)
- Raděk Holý - Raděk Holý, PhD, Assistant Professor at the University of Technology, Prague. Ing. Jiří Háze, Ph.D. (haze@vut.cz)
- MU - Mgr. Jan Mysliveček, Ph.D. (myslivecek@ics.muni.cz)